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TSMC A16 Uses Backside Power Delivery, Set for Q4 2026 Mass Production
A16 is expected to enter mass production in Q4 2026, using the Super Power Rail backside power delivery network and GAAFET nanosheet transistors, according to reports cited by TrendForce.
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TSMC A16 Uses Backside Power Delivery, Set for Q4 2026 Mass Production
A United Daily News reprint report says TSMC’s A16 process is expected to enter mass production in the fourth quarter of 2026. TrendForce, citing a report, said A16 uses the Super Power Rail backside power delivery network and GAAFET nanosheet transistors.
Compared with N2P, A16 is expected to improve performance by 8% to 10% at the same voltage and complexity. At the same frequency and transistor count, it is expected to reduce power consumption by 15% to 20% and increase chip density by 1.07 to 1.10 times, TrendForce said, citing a report.
Analysts said backside power delivery adds wafer bonding, wafer thinning, CMP, backside etching, thin-film deposition, and inspection and metrology processes. C Sun MFG’s business is related to CMP processing and diamond-disk consumables; Phoenix Silicon International’s business is related to recycled wafers used in equipment tuning, process validation and mass-production monitoring.
TrendForce, citing a report, said implementing A16’s backside power delivery requires redesigning the power-delivery network and thermal management, as well as updating EDA tools and simulation software.