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TSMC’s U.S. Advanced Packaging Push Targets First-Half 2028 Operation
GlobalFoundries and Amkor are building parts of a U.S. advanced-packaging supply chain around 2028, while the estimated timing for TSMC’s Arizona facility remains unconfirmed and execution risks persist.
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The first half of 2028 could become a key convergence point for the U.S. CoWoS supply chain. GlobalFoundries plans to supply silicon interposers from its Malta, New York, facility, while Amkor plans to begin production at its Arizona packaging facility in early 2028. Industry estimates say TSMC’s first Arizona advanced-packaging facility could also begin operating as early as the first half of 2028, but TSMC has not officially confirmed that timing.
GlobalFoundries and TSMC signed a multiyear manufacturing agreement valued at $2 billion. Under the agreement, whose initial term is five years, GlobalFoundries will establish a U.S. silicon-interposer supply from its Malta, New York, facility to support high-performance computing and artificial-intelligence systems; capacity is expected to ramp in the first half of 2028.
Amkor plans to begin production at its Arizona packaging facility in early 2028. The campus will include wafer bumping, probing, assembly and testing capabilities. Its second-phase expansion will add 60,000 square meters of cleanroom space, bringing the campus total to about 93,000 square meters and raising planned investment to about $12 billion.
Amkor’s second phase is scheduled to begin at the end of 2027 and be completed by the end of 2029. Kevin Engel, Amkor’s president and chief executive officer, said the expansion reflects customer confidence in Amkor, the key role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic position of its Arizona campus.
“The second-phase expansion reflects customer confidence in Amkor, the key role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic position of its Arizona campus,” said Kevin Engel, Amkor’s president and chief executive officer.
However, the first-half 2028 operating timing for TSMC’s Arizona advanced-packaging facility remains an industry estimate, not an official confirmation from TSMC. Amkor also cautioned that there is no guarantee its Arizona campus will be completed on schedule, within cost and to specifications, or generate the expected benefits.
Sources
- 台積電在美先進封裝 拚2028上半年運轉 - 日報 - 工商時報 (www.ctee.com.tw)
- GlobalFoundries and TSMC reach $2B deal for US-based silicon interposers | Manufacturing Dive (www.manufacturingdive.com)
- Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion | Amkor Technology (ir.amkor.com)