Taiwan
UMC Prices US$1.8 Billion Seventh Overseas Convertible Bond Offering at 0% Coupon
UMC said its seventh unsecured overseas convertible bond offering totals US$1.8 billion, split between five-year A bonds and 18-month B bonds. Proceeds will fund machinery and plant engineering, while full conversion of this overseas unsecured convertible bond offering at the conversion price set at issuance would dilute existing shareholders by about 2.34%.
AiSiWhale・Published
UMC completes pricing of US$1.8 billion offering
United Microelectronics Corp. (UMC, 2303) announced that its seventh unsecured overseas convertible bond offering totals US$1.8 billion, with US$900 million each in A and B bonds. Both tranches will be issued at 100% of face value on October 13, 2026, with a 0% annual coupon.
UMC said the A bonds mature five years after issuance, while the B bonds mature 18 months after issuance, creating two separate maturities.
The A bonds carry a conversion price of NT$202.06 per share, set at 132.5% of the NT$152.5 closing price on the pricing date of October 5, 2026. The B bonds carry a conversion price of NT$179.19 per share, set at 117.5% of the same closing price.
UMC said the proceeds from this overseas unsecured convertible bond offering will meet funding needs for machinery purchases and plant engineering. UMC said that if this overseas unsecured convertible bond offering is fully converted into common shares at the conversion price set at issuance, the dilution to existing shareholders would be about 2.34%.
The bonds will be issued and traded on the Singapore Exchange, and the announcement said there is no arrangement for subscription by designated persons.
Sources
- 聯電（2303）公告本公司第七次海外無擔保轉換公司債完成訂價 (openapi.twse.com.tw)